스핀들의 회전 정밀도를 높이고 표면 거칠기 개선 --dotted line--   Wafer Edge Grinding: W-GM-5200 • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. • The non-contact measuring method achieves the stable alignment. • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. • The modular concept to make the optimum process line possible. • Low damage grinding method is available.   Feature 1 :  Machine specification ready for 300 mm and 200 mm wafer.  Feature 2 :  Visual system (optional) for measuring the chamfer width of periphery and notch.