Illumination meter, three-dimensional meter (W-GM-5200)

스핀들의 회전 정밀도를 높이고 표면 거칠기 개선<br><br><br><br><br><br>Wafer Edge Grinding:W-GM-5200• Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.• The non-contact measuring method achieves the stable alignment.• • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.• The modular concept to make the optimum process line possible.• Low damage grinding method is available.Feature 1 :Machine specification ready for 300 mm and 200 mm wafer.Feature 2 :Visual system (optional) for measuring the chamfer width of periphery and notch.